Bonding
CAMX 2019 exhibit preview: Tantec
Tantec is featuring its full line of plasma treatment systems, with specific emphasis on PlasmaTEC-X, the newest product in the company’s atmospheric plasma treatment line.
Read MoreCAMX 2019 exhibit preview: BTG Labs
BTG Labs is featuring its recently launched Surface Analyst XA, an automated solution for evaluating material surfaces for bonding, coating, sealing, painting or printing.
Read MoreCAMX 2019 exhibit preview: ATSP Innovations Inc.
ATSP Innovations Inc. is exhibiting its full line of high-temperature resins at CAMX 2019, as well as its Self-Bond adhesive process.
Read MoreSolvay epoxy-based film for prepregs
Solvay Composite Materials has developed FusePly, an epoxy-based film that is designed to co-cure with a prepreg and provide a chemically active surface that reacts with functional groups in adhesives to create a covalently bonded structure.
Read MoreHuntsman introduces high-performance adhesives and composites systems
The company’s new edge and void fillers and stuctural adhesives are designed for aerospace composites.
Read MoreCarbon fiber-reinforced parts 3D-printed for catamaran
A Swiss engineering company combined 3D printing, bonding technology and carbon fiber composites to develop lighter, more efficient marine bearing cages.
Read MoreThermoplastic overmolded thermosets, 2-minute cycle, one cell
Adhesive-free, functionalized hybrid composites enabled by industry-first, integrated molding cell.
Read MoreEpoxies, Etc. launches fast curing toughened epoxy
Epoxies, Etc. (Cranston, R.I., U.S.) has launched its new 10-3041 Toughened Epoxy Adhesive, which reportedly develops a 3,000 psi lap shear strength within four hours.
Read MoreMeasuring temperature inside composites and bondlines
ThermoPulse sensors offer Industry 4.0 temperature measurement and digital cure cycle management for bonded composite repairs, laminates and more.
Read MoreVELOX to distribute Ashland products in Nordics region
The agreement includes Ashland’s resins, gelcoats, bonding pastes and low profile additives.
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