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AGY (Aiken, S.C., U.S.) announces the launch of L-HDI, a low coefficient of thermal expansion (CTE) glass fiber engineered specifically for advanced packaging substrates and chip packaging in next-generation AI hardware.

This product marks a significant milestone for AGY, as L-HDI completes the company’s AI-focused glass fiber portfolio, which now includes a full range of solutions optimized for the semiconductor, high-performance computing and advanced networking sectors. The L-HDI product provides dimensional stability, thermal reliability and mechanical integrity essential for AI-specific integrated circuit packaging, particularly for high-density interconnect (HDI) and substrate core materials.

U.S.-made L-HDI offers an ultra-low CTE, improving warpage control in IC substrates. Its high modulus resists deformation when exposed to heat and mechanical stress, and it features optimal dimensional stability under high thermal loads. In addition, the glass fiber is optimized for IC substrate manufacturing.

AGY’s glass fiber offerings — including L, L2 and now L-HDI — are used across a range of AI-enabling components, from optical transceivers and high-speed routers to IC substrates and semiconductor packaging.