Products
Verisurf releases software update
The latest update of Verisurf’s automated quality inspection software is said to improve efficiency and quality.
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PES additive boosts resistance to fracture and micro-cracking in epoxy composites
Often used by the aerospace industry for prepreg and resin-transfer molded carbon fiber-reinforced epoxy, the additive is gaining ground in epoxy composites for automotive and other markets.
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Techsil launches clear, epoxy adhesive for composite substrates
EP25880 Clear cures to a clear product and provides a strong, tough and durable bond on carbon fiber composite parts.
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Evonik launches low-odor reactive diluent
In adhesive formulations, composite resins and gel coats, the reactive diluent can replace styrene and methyl methacrylate, either partially or in full.
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Airtech launches high temperature vacuum bagging materials for thermoplastic molding
The company has released a new high performance release film, a new sealant tape for high temperature applications and non-woven blended, fiberglass breathers.
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Roth unveils robot filament winding machines
The technology uses a six-axis robot to move the fiber delivery eye – used for the fiber guide during the winding.
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New SAERTEX products offer fire protection
The company has released two new products in the area of fire protection for composites, SAERTEX LEO Coated Fabric and SAERcore LEO.
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BASF develops particle foam based on polyethersulfone
New foam is characterized by high-temperature resistance, inherent flame retardancy and light weight coupled with good stiffness and strength.
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New carbon fiber filament brings 3D printing closer to industrial production
Royal DSM launches new carbon fiber filled grade PA6/66 filament Novamid ID1030 CF10 for 3D printing.
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Asahi Kasei launches Thermylene P11
Next-generation family of glass-reinforced polypropylene (PP) compounds opens new opportunities for thinwall molding of interior and exterior automotive parts.
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Latest Moldex3D version improves RTM simulation workflow
Latest Moldex3D version includes more control over complex layer layer orientations and improved RTM pre-processing workflow.
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New modular direct diode laser technology for tape replacement applications
New diode laser technology aims to scale up the production capability of tape placement systems.
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