New modular direct diode laser technology for tape replacement applications
New diode laser technology aims to scale up the production capability of tape placement systems.
With the aim of scaling up the production capability of tape placement systems, Laserline (Mülheim-Kärlich,Germany), a pioneer in diode laser technology, has developed a modular direct diode laser with a housing width below 50 mm, which enables the integration of multiple heads in a single set-up. The processing head with integrated laser source and optics generates a rectangular, fully homogenized laser beam, which can be customized to the tape sizes, for example 25 mm x 55 mm. The maximum laser power of 2.5 kW per processing head ensures high process speeds and the reliable melting of the tape material. A high working distance of more than 200 mm enables contamination and collision free manufacturing. While using solely industrial-proven standard components in a novel compact and modular approach, a fast and reliable process ramp up is ensured.
A new level of cost efficiency can be achieved by consideration of the complete system composition e.g. inclusion of the power supply, which is capable of supplying multiple processing heads with a single unit.
is part of the international composites network. This post is courtesy of the ÂÌñÏ×ÆÞ and AZL Aachen GmbH media partnership.
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