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 (Valencia, Calif., U.S.), a company manufacturing precision diamond cutting tools, has unveiled its next-generation diamond and CBN with Smart Cut technology. These solutions are optimal for industries that require ultra-thin, high-precision cutting, such as semiconductors, electronics, optics, ceramics, composites and advanced materials industries.

UKAM Smart Cut dicing blades feature high precision and edge quality, with reduced chipping, straighter cuts and smoother finishes. Blade life is enhanced and multiple bond types — including metal (sintered), Hybrid Bond, resin, nickel (hubbed and hubless) and carbide — are available, each optimized for brittle and composite materials. Sizes range from 12-150 mm and thicknesses as thin as 0.001" (25 µm). 

Leonid Feldman, president of UKAM Industrial Superhard Tools, says the technology ensures every diamond particle works at its maximum potential, “delivering cleaner cuts, longer blade life and greater reliability across demanding applications.”

UKAM’s Diamond & CBN Dicing Blades are compatible with all major dicing saws and slicers. Each blade is supported by detailed technical resources, process optimization guides and the company’s customer service.