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Master Bond Inc. (Hackensack, N.J., U.S.) introduces EP29LPSPND-3, a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications in aerospace, oil and gas, and cryogenic AI chips. For fiber-reinforced applications, it can be especially useful when the end user requires a non-drip paste that does not wick/flow.

The system is electrically nonconductive and thermally insulative, with a thermal conductivity of approximately 0.2 W/(m•K) at room temperature. It withstands cryogenic temperatures and is serviceable in the range from -452.47°F to 250°F.

EP29LPSPND-3 features a coefficient of thermal expansion of 45-50 x 10^-6 in/in/°C, a tensile strength of 6,000-8,000 psi and a Shore D hardness of 70-80. This system has a volume resistivity exceeding 10¹⁵ ohm-cm at 75°F and a dielectric constant of 4.2 at 60 Hz. A key performance attribute is its ability to withstand temperature cycling even at cryogenic levels.

The non-drip epoxy has a mix ratio of 100:65 by weight with a long working life after mixing; a 100-g batch will yield an open time of greater than 5 hours at 75°F. The color of Part A is clear-translucent, and Part B is amber-clear; it cures clear when applied in thin sections despite being a paste, with a refractive index of 1.56 at 589 nm. The recommended cure schedule is either 12-18 hours at 130-150°F or a faster 5-10 hours at 150-165°F. EP29LPSPND-3 is available in ounce jar kits, half pint kits, pint kits, quart kits and gallon kits.