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(Valencia, Calif., U.S.) has introduced a new generation of designed to improve precision, efficiency and material yield when cutting hard, brittle and composite materials.

The new saws feature a high-tensile wire embedded with precision-graded diamond particles, enabling ultra-thin cuts with reduced kerf loss. According to the company, this design minimizes chipping, improves surface integrity and achieves faster cutting speeds with greater accuracy compared to conventional methods.

Applications for the Diamond Wire Saws include aerospace and automotive composites, semiconductor wafers and substrates, ceramics, glass, crystals, biomaterials and specialty alloys. UKAM notes that the technology is suitable for industries requiring delicate sectioning of advanced materials where maintaining structural integrity and minimizing waste are critical.

Key benefits of the Diamond Wire Saws include:

• Ultra-thin kerf for maximum material utilization
• Consistent surface quality with reduced micro-cracking
• Versatility across composites, semiconductors, ceramics, metals and biomaterials
• Extended tool life, reducing overall cutting costs.

“Diamond Wire Saws represent the next step in precision cutting technology,” notes Brian Farberov, vice president at UKAM Industrial. “They allow engineers and researchers to achieve higher productivity while meeting the demanding tolerances of today’s advanced materials.”