Last call for ITHEC conference abstracts
The thermoplastic composites event, taking place Oct. 9-10 in Bremen, Germany, is seeking oral and poster contributions before March 31.
Source | ITHEC
Interested parties can now submit speaker or poster abstracts for the , taking place in Bremen, Germany, from Oct. 9-10, 2024. Event organizers are seeking oral and poster contributions from engineers, scientists and experts who are actively engaged in the field of high-performance thermoplastic composites and related manufacturing technologies and applications.
should be a maximum of 250 words. A submission may also include a PDF file that includes graphs and pictures to illustrate the abstract further. The deadline for abstracts is March 31, 2024. Any questions can be sent through service@ithec.de.
Selected abstracts will be announced April 30. It should be noted that for oral presentation (25 minutes, including discussion), preference will be given to contributions expressing a comprehensive view of the chosen subject, e.g., in an achievement, a challenge or needs to be addressed to industry. Please note that detailed theoretical contributions and papers of a very specialized nature are more suitable for the poster area.
The ITHEC conference covers the latest developments in high-performance thermoplastic composite applications in aerospace, automotive and energy applications, as well as transport and engineering. The program consists of keynote lectures, a panel discussion as well as multiple sessions curated by the international program committee. In addition, the conference is supplemented by the poster area within the exhibition hall.
“ITHEC is a great place to meet peers passionate about thermoplastic composites and to gain insight into the latest developments,” notes SAM|XL’s Bram Jongbloed, the Best Poster Winner at ITHEC 2022. “During my poster presentation, I was pleased to have in-depth technical discussions with both academia and industry on our welding process. I’m looking forward to the next conference.”
Submit abstracts .
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