Ketones
JEC World 2018 preview: Hexcel
Hexcel (Hall 5, J41) is featuring products for customer applications in aerospace, automotive, wind energy and marine markets.
Read MoreDelivering the potential of thermoplastic composites
Why has the adoption of TPCs been slower than expected, and who is best placed to accelerate it?
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JEC World 2018 preview: Porcher
Porcher Industries (Eclose-Badinières, France) will have a talented team of textile, composite and chemical engineering experts in Paris to present their latest innovations at JEC World 2018.
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Consolidating thermoplastic composite aerostructures in place, Part 2
Thermoplastic composite structures could eliminate the autoclave and fasteners, but will a one- or two-step process prevail?
Read MoreTechsil acrylate-based adhesive cures via light
Distributor Techsil (Bidford-on-Avon, UK) has introduced a new light-curing adhesive called Vitralit UV 4802, for bonding high-temperature-resistant thermoplastics such as PEEK with other non-compatible materials.
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Airborne, Siemens and SABIC partner to mass produce thermoplastic composites
Flexible, automated production lines, featuring radically low conversion costs, aimed at millions of parts/yr — CW’s interview with all three companies.
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Toho Tenax recognized for “Closed Circle of Thermoplastic Composites”
Recycled compound shows 34% less environmental impact and 40-60% lower cost vs. original formulation.
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Brook One introduces burnthrough cover films for aerospace
Brook One Corp. has introduced two burnthrough cover films for the aerospace industry, BO 856B-I-LWT (metallic) and BO 856B-II-LWT (non-metallic).
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I want to say two words to you: “Thermoplastic tapes”
Thermoplastic tapes are not new to composites, but they soon will join the primary aerostructures material palette and could be their future.
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Testing, use substantiate m-pipe subsea use
Magma Global’s m-pipe, based on high-performance VICTREX PEEK thermoplastic composites, has recently achieved the world’s first qualification for a subsea pipe product under DNVGL-RP-F119.
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